| 학회 | 한국화학공학회 |
| 학술대회 | 2003년 봄 (04/25 ~ 04/26, 순천대학교) |
| 권호 | 9권 1호, p.53 |
| 발표분야 | 고분자 |
| 제목 | Adhesion Properties of Polyimide Film Treated by Atmospheric Pressure Plasma |
| 초록 | In this work, the effect of plasma treatment on polyimide film is studied in atmospheric pressure. The input treatment power for the plasma is varied between 0 and 300 W, namely P-0, P-150, P-200, and P-300. Surface properties of polyimide film treated by the plasma are investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles. And the adhesion characteristics of the polyimide/copper film are studied in peel strengths. As a result, the polyimide surfaces treated by the plasma lead to an increase of oxygen-containing functional groups or polar component of the surface free energy as a function of the treatment power, resulting in improving the adhesion characteristics of the polyimide/copper film. However, the surface energy of the polyimide film is slightly decreased as the aging time increases. The results can be discussed in the formation of surface functional groups or deterioration of reactive sites of polyimide film in the presence of the atmospheric pressure plasma treatment with aging time. |
| 저자 | 조기숙1, 박수진1, 김성현2 |
| 소속 | 1한국화학(연), 2고려대 |
| 키워드 | polyimide; atmospheric pressure plasma; aging effect; surface free energy; adhesion characteristics |
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