| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.107 |
| 발표분야 | 고분자 합성 |
| 제목 | Studies of thermal imidization kinetics of polyisoimide based upon 4,4’-[1,4-phenylene-bis-(1-methyl ethylidene)] bisaniline and 4,4’-oxydiphthalic anhydride in solid state |
| 초록 | The curing kinetics of the polyisoimide (BIS-P/ODPA), based upon 4,4-[1,4-phenylene-bis-(1-methyl ethylidene)] bisaniline (Bis-P) and 4,4-oxydiphthalic anhydride (ODPA), has been studied by differential scanning calorimetry (DSC). The glass transition temperatures of the partially imidized polyisoimides (Bis-P/ODPA) were measured by DSC as a function of fractional conversion. The thermal imidization of polyisoimides in the solid state showed a maximum degree of imidization that can be achieved at a given isothermal temperature probably due to the diffusion controlled reaction characteristics near vitrification (Tg effect). Dynamic curing studies were performed at different heating rates of 1, 2, 5, 10, 15, 20, 25, 30 C/min. These data were analyzed for obtaining activation energy and pre-exponetial value for the imidization reaction. The thermal imidization was well described by first order kinetics with an activation energy of 170 181 KJ/mol and the pre-exponential factor of min-1. ACKNOWLEDGMENT This work was supported by grant No. R01-2001-000-00418-0 from the Korea Science & Engineering Foundation. |
| 저자 | 황윤선;김영준;김지흥;김덕준;원종찬;최길영;홍영택 |
| 소속 | 성균관대 |
| 키워드 | |
