| 초록 |
As an effort to increase the density of surface mounted passives on PCB, embedding techniques are actively being employed by many researchers. Despite the importance of this technique, there are many practical problems for the realization of embedding technique in PCB manufacturing process. Due to the structural limits of embedded PCB (very thin layered structure and limit of space), materials and processes should be newly designed based on the conventional PCB process. In the case of embedded capacitor, new materials (~nm scale), surface treatment and cleaning, connection of electrodes, patterning of metal-insulator-metal (MIM) structure, and adhesion between different layers are the major concerns for the realization of embedding and mass production. Among those problems, we examined the applicability of adhesion layer to ensure the reliability of layered structure instead of conventional surface treatment, avoiding the damage of extremely thin dielectric layer in embedded capacitor. |
