| 초록 |
Semiconductor package is composed of wafer, substrate, and adhesives that attach these two parts. So, adhesives are significant factor to determine the reliability of package. Dicing die-bonding adhesive is composed of two adhesive layers and two films and each adhesive layer has different purpose. Chip and chip or chip and substrates are attached by the 1st adhesive layer, so it requires heat-resisting property and high strength of adhesion. Epoxy resins are usually used for Dicing die-bonding adhesives. It shows excellent chemical, mechanical and electric properties, but weak heat resistance and some absorption of water. Because of its heterocyclic imide ring, siloxane imide was selected to improve adhesion strength and heat resistance. So, the purpose of this study is to synthesize and apply an adhesive which has strong adhesion and heat resistance. In this study, end group of siloxane imide was reacted with epoxy groups and their properties were examined via DMA, DSC, TGA, UTM. |
