| 초록 |
One of the requirements mandated for superior performance of modern electronic devices is improved reliability in the electrical properties of the materials utilized. The reliability of the final package depends upon the materials used, the manufacturing techniques and the interaction of the materials with the environment during and after processing. Among the high-performance polymeric materials, polyimides(PIs) represent an optimal combination for many high-tech applications that require great mechanical strength, a resistance to high temperatures and low dielectric constant. To some degree, unfortunately, these polyimides interact with the environment, collecting a thin film of moisture that can alter their dielectric properties.In this paper, two commercially applied PIs(PMDA-ODA and 6FDA-ODA) with different structures were prepared to obtain PI-PI blends. Then, the dielectric constants of PI-PI blends prepared by solution blending have been measured over a frequency(1kHz) as a function of time and weight fraction.
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