| 초록 |
In the process of bonding ceramics using glass frit, it is necessary to lower the glass bonding temperature and increase the contact area between the glass and the ceramic. In this study, to lower the temperature at which the glass frit is wetted on the alumina substrate, PbO thick films with the dense structure were prepared on the alumina substrates by aerosol deposition (AD) method. In the process of forming the Bi based glass pellet on the substrates, it was confirmed that the wettability was improved due to the chemical reaction between the PbO film and the glass. Glass wetting behavior during heating process was confirmed by high temperature microscopy, and the diffusion of PbO into glass by reaction was confirmed by the EDX. As a result of the bonding strength test on the sample annealed at 430℃, the sample with the PbO film showed higher bonding strength than the sample without the PbO film due to larger contact area. |
