| 초록 |
Epoxy resin has excellent physical and mechanical properties. It has used in extensive industrial applications, especially in the field of epoxy molding compound (EMC). In this study, we attempted to enhance thermal stability of EMC using modified curing agent containing diimide group. The primary objective of this study focuses on synthesizing curing agent including imide group for EMC system. The diimide dicarboxyric acid (DIDa) monomer was synthesized from trimellitic anhydride (TMA) and methylene dianiline (MDA), or oxy dianiline (ODA). From the result of DSC, EA, 1H-NMR and FT-IR, we confirmed that DIDa was synthesized. DIDa was used to curing agent in the EMC system, which was composed with Bisphenol A type, or Phenolnovolac type epoxy resin. Basic properties of prepared samples were performed by DSC, TGA, FT-IR, EA, 1H-NMR, and GPC. The curing kinetics were measured from real-time FT-IR and RMS in the variable temperature and contents. |
