| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 가을 (10/10 ~ 10/11, 부경대학교) |
| 권호 | 28권 2호, p.371 |
| 발표분야 | 기능성 고분자 |
| 제목 | Preparation and Properties of Polyimide/Silica Hybrid Materials as Multichip Packaging Material by Sol-Gel Process |
| 초록 | The organic-inorganic hybrid materials by the sol-gel method have been widely studied recently for both scientific and industrial interests. To synthesize the prominent homogeneous organic-inorganic hybrid, the fully hydroxy-containing aromatic polyimide thin film based on 2,2-bis(3,4’-dicarboxyfluoropropane) (6FDA) , 2,2-bis(3-amino-4-hydroxylphenyl)-hexafluoropropane (AHHFP) and 4,4’-Oxydianilin(ODA) was prepared with 3-aminopropyltrimethoxysilane (APTMS) as the coupling agent of organic-inorganic hybrid and reacted with tetraethyl orthosilicate (TEOS) by sol-gel method. The FT-IR was used to confirm synthetic material and TGA was used to investigate the thermal properties. In addition, the morphological structure of the hybrid containing various amounts of silica, such as the domain of silica particles, orientation and crystallization, was studied with Prism-Coupler and SEM photographs. For the all prepared organic-inorganic hybrid materials by the sol-gel process, the homogeneous synthesis and prominent properties were found depending on the silica content. Acknowledgement: This work was supported by Korea Research Foundation. |
| 저자 | 이보영, 권진욱, 김도완, 한학수 |
| 소속 | 연세대 |
| 키워드 | Polyimide/Silica Hybrid; Sol-gel |
