| 학회 | 한국재료학회 |
| 학술대회 | 2008년 가을 (11/07 ~ 11/07, 차세대융합기술연구원) |
| 권호 | 14권 2호 |
| 발표분야 | 구조재료 |
| 제목 | Dynamic compaction of Cu/CNT composite using planar shock wave |
| 초록 | Shock wave generated by the planar impact or explosives can be applied on one step consolidation process from powder materials to monolithic bulks or composites without sintering process under a high temperature condition. During shock wave propagating the powder materials, very high uniaxial pressure with high shock energy is applied on them, then the shock energy can be transferred to the bonding energy of powders. Such a research field have been issued for recent two decades, and some researchers have reported that mechanical properties of some metal was improved, and others reported that some ceramic materials like diamond, boride and nitride which can not be easily sintered, was consolidated succefully. In this study, a metal/CNT composite was consolidated by shock wave by the planar impact. It is expected that the bonding strength between metal and CNT can be improved by the energy transfer from impact to bonding. By measuring of the mechanical properties and microstructural analysis, the mechanism of Cu/Cu bonding under shock wave applying, the effect of CNT on the Cu/Cu bonding, and the bonding state of Cu/CNT interface will be investigated. |
| 저자 | 김하늘, 김도경 |
| 소속 | 한국과학기술원 |
| 키워드 | Shock wave; composite; CNT |
