| 학회 | 한국재료학회 |
| 학술대회 | 2007년 가을 (11/02 ~ 11/02, 성균관대학교) |
| 권호 | 13권 2호 |
| 발표분야 | 전자재료 |
| 제목 | The Study of Reproduction Ni Mold for Imprinting by Self Assembled Monolayer Method |
| 초록 | Nanoimprint lithography (NIL) is the alternative method to transcribe a pattern on substrate by physical contact between mold and substrate. NIL offers a sub-10 nm feature size, high throughput, and low cost. Molds, apparatuses for imprinting and anti-adhesion layers are important factors to form the patterns on substrate successfully. Mold which has various patterns is the most important factor in NIL. There are some kinds of mold for NIL. Si and Ni mold are the most popular materials for NIL. Si is well known material so it is easy to make patterns by using conventional lithography. However, Si mold is too weak and it is easy to broken. Ni mold is developed to overcome because Ni mold is stronger than Si mold. Ni mold is made by electroplating on Si mold. Electroplated sample is dipping in KOH to remove Si mold. Si mold is etched and then finally only Ni mold is remained. This conventional method needs to consume a Si mold to make a Ni mold. In this study, Ni mold was made without Si mold consumption by using hydrophobic layer. Hydrophobic layer was used for anti-adhesion layer to separate Ni mold and Si mold. Hydrophobic layer is formed with vapor SAM (self assembled monolayer) method. It is possible to make many Ni mold from one Si mold to use developed method. |
| 저자 | Si-Hyeong Cho1, Min-Soo Cho2, Kyu-Chae Kim1, Hyun-Woo Lim2, Jin-Goo Park3 |
| 소속 | 1Div. of Bio-Nano Technology, 2Hanyang Univ., 3Div. of Material and Chemical Engineering |
| 키워드 | Nanoimprint lithography (NIL); electroplating; mold; SAM |
