| 초록 |
A thermoplastic polyphenylene oxide (PPO) was used in this study to modify dielectric property of epoxy resin. A difunctional epoxy resin monomer, a diglycidyl ether of bisphenol A (DGEBA), and an aromatic amine curing agent, 4,4'-diaminodiphenyl methane (DDM), were used as the primary epoxy matrix materials. PPO was added additionally in the range of 0 to 20 wt% in order to improve dielectric property of epoxy matrix. Thermal and dielectric properties of the prepared epoxy resin/PPO blending systems have been investigated as a function of PPO content. The glass transition temperature (TG) was not changed noticeably up to 10 wt% of PPO content and then decreased rapidly with further increment of PPO content. In addtion, dielectric property was also influenced significantly by PPO content. The value of dielectric constant was decreased approximately 24% at 10 wt% of PPO content and then slightly increased afterward. |
