| 초록 |
If using the sodium hypochlorite as the etching solution, acid waste copper chloride of 27.5~31.5wt% is generated. The preparation of copper oxide(II) powder for electroplating have a way that the copper chloride react with sodium carbonate and sodium hydroxide. But, the calcination of the temperature at 300~800℃ is necessary when using of the sodium carbonate, and to remove the chlorine ion is difficult when using of sodium hydroxide. In this study, the copper chloride is purified using the PCB etching wastes, the chlorine ion remove less than 500mg/L using the sodium carbonate, and next copper oxide powder for electroplating was manufactured by reducing the chlorine ion less than 30mg/L using the sodium hydroxide. The change in the yield and plating characteristics were assessed according to each step sodium hydroxide and sodium carbonate concentration, temperature, and pH. |
