| 학회 |
한국고분자학회 |
| 학술대회 |
2011년 봄 (04/07 ~ 04/08, 대전컨벤션센터) |
| 권호 |
36권 1호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
The Thermal Stability of the Si-modified Acrylic PSAs onthe Si-wafer Pick-up Process |
| 초록 |
“Multi-Chip Packages”(MCP) refers to a packaging configuration containing at most five chips, connected to a multilayer circuit board via wirebonds, and are protected by either a molded encapsulant or a low-cost ceramic package. This is the same as if all the chips were integrated into a single die and packaged because the same form factor and footprint are kept to facilitate the subsequent board assembly operations. Pressure-sensitive adhesives for MCP semiconductors in manufacturing processes need to satisfy some points. PSAs are branch of adhesives that attach to the substrate by low pressure contact, and do not require any reaction processes, such adhesives. PSAs can be peeled from the substrate without failure. The purpose of this study is to investigate the thermal stability of the Si-modified acrylic PSAs on the Si-wafer Pick-up Process. |
| 저자 |
권영은1, 이승우1, 박지원1, 김현중1, 김경만2
|
| 소속 |
1서울대, 2한국화학(연) |
| 키워드 |
PSAs; Thermal properties; Pick-up Process; Si-wafer
|
| E-Mail |
|
