| 초록 |
Polyimide(PI) films are generally used in electronic devices for its thermal resistance and durability. Two dimensional graphenes show high thermal conductivity, and it is expected to contribute the thermal dissipation properties when it is added to make PI composite films. It is also expected to enhance the barrier properties of PI film. However, distribution of graphene within the PI matrix is limited to make uniform PI composite. In this work, graphene oxide(GO) with different concentration was added to polyamicacid(PAA), which undergoes simultaneous PI polymerization and GO reduction to make rGO/PI composite by curing process. Graphene was dispersed in N,N-dimethylacetamide(DMAc) and was added to the PAA solution in DMAc. GO added solution was treated by using tip sonicator for the better GO dispersion. |
