| 초록 |
Recently, sapphire wafers have been widely used for electronic and semiconductor industries. In order to obtain good surface quality of the sapphire wafers, polishing media is important and the polished surface is highly sensitive to abrasion between polishing pad and the surface of sapphire wafer during the polishing processing. In this experiment, the nano size WC powder were selected to polish the sapphire wafers and the amount of the nano size WC in the polishing slurry is one of the most important factors affecting the final polishing properties of glass wafers. In order to determine proper amount of nano WC in the slurry, sapphire wafers were polished by using three different polishing slurries with 5wt%, 10wt% and 15wt% of nano WC. Experimental results showed that surface roughness of sapphire wafers is best at the polishing slurry with 10wt% of nano WC. |
