학회 |
한국재료학회 |
학술대회 |
2012년 가을 (11/07 ~ 11/09, 라카이샌드파인 리조트) |
권호 |
18권 2호 |
발표분야 |
C. 에너지/환경 재료(Energy and Environmental Materials) |
제목 |
INFLUENCE OF SURFACE CONDITION TO TEXTURING PROCESS ON CRYSTALLINE SILICON SOLAR CELLS |
초록 |
For high efficiency silicon solar cells, surface texturing is used to increase the short circuit current by reducing the surface reflection loss. Surface texturing is an anisotropic wet chemical etching process commonly used to form random pyramids. Before Surface texturing process, in order to remove the wafer surface defects and damage caused by wire sawing, saw-damage etching was performed using alkali solution (KOH etc.). We studied how the process is affected by surface conditions of as-cut, polished and saw-damage etched wafers. We also compared the texturing behavior and cell performances. Textured samples with different processing times were analyzed to detect pyramids and determine weighted reflectances at 2, 5, 10, 20, 30 ,60 minutes. After the texturing process, conventional screen-printed solar cells were fabricated to compare the cell performance by Suns-Voc and quantum efficiency. For the saw-damage etched and polished samples, we consider that the performance is degraded owing to additional damages. Thus, the processing-cost can be reduced by removed the saw-damage etching process. |
저자 |
김현호, 박성은, 강병준, 배수현, 박효민, 탁성주, 김동환
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소속 |
고려대 |
키워드 |
Surface texturing; Saw-damage etching; Crystalline silicon solar cells
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E-Mail |
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