| 초록 |
The residual stress behavior of both BPDA-PDA and 6FDA-ODA polyimide during curing and sequent thermal cycling was investigated. Particularly, the stress in the cooling region of curing process depended on the thermal expansion behavior of polyimide. So, flexible 6FDA-ODA polyimide had high residual stress value than semi-rigid BPDA-PDA at room temperature. In addition, the residual stress behavior was detected after aluminum was deposited on the fully cured BPDA-PDA polyimide. That behavior was somewhat different with that before aluminum deposition. In particular, the tensile stress was generated in high temperature region and subsequently, higher stress than before Al deposition was observed at room temperature.
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