| 학회 | 한국고분자학회 |
| 학술대회 | 2002년 봄 (04/12 ~ 04/13, 서울대학교) |
| 권호 | 27권 1호, p.138 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Effect of the structure on residual and thermal stress in poly(amide-imide)s |
| 초록 | Poly(amide-imide)s are amorphous, injection-moldable thermoplastic that exhibit outstanding mechanical properties at high temperature with good dimensional stability, excellent creep, impact and chemical resistance. They can be used in aerospace, transportation, chemical processing and electronics. For poly(amide-imide) films, the residual and thermal stress are investigated by using a Thin Film Stress Analyzer (TFSA), and the refractive indices and birefringence by using prism coupler, respectively. In addition, their morphological structure was analyzed by using wide angle x-ray diffraction (WAXD). Residual and thermal stress measurements offered information about the degree of thermal expansion and chain mobility. Through the understanding of effects of the residual and thermal stress on process history, we could appreciate effects of changes in processing. Acknowledgment : This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation |
| 저자 | 김시은, 김상욱, 이춘근, 한학수 |
| 소속 | 연세대 |
| 키워드 | |
