| 초록 |
Since the early development of composites materials, polymer composites have primarily been used for structural application. Recently, polymer composites have become a great candidate for heat dissipation materials in electronic applications. Most polymers were restricted for using as heat dissipation materials due to their low thermal conductivity. One approach to enhancing the thermal conductivity of polymers has been to add suitable fillers that possess high thermal conductivity. In this study, the thermal conductivity of the composites based on boron nitride (BN) filled liquid crystal polymer (LCP) was investigated as a function of particle size, aspect ratio, and concentration of BN to develop the heat dissipation materials. Both the through-plane and in-plane thermal conductivity of the resulting composites were tested using the laser flash method. Additionally, several thermal conductivity models were introduced to predict the thermal conductivity of the composites. |
