| 초록 |
In this study, interfacial bond strength of an epoxy resin according to various curing conditions is investigated. Curing behavior of the epoxy resin was studied in both dynamic and isothermal conditions by means of differential scanning calorimetry. Bond strength and chemical structure of the epoxy resin after curing were studied by shear strength test, infrared spectroscopy and gas chromatography, respectively. The bond strength of epoxy resin was largely dependent on curing conditions. Especially, at the curing temperature below 115 ℃, the interfacial bond strength was remarkably low even though the epoxy resin was fully cured. |
