| 초록 |
The relations between residual stress and adhesion strength according to the development of molecular orientation of the polyimide films coated on Cu with different chemical backbone structure were studied. Depending on various structure, residual stress experiments between polyimide film and Cu-Si wafer were carried over a range of 25~400oC by using in situ Thin Film Stress Analyzer (TFSA). The residual stress on Cu-Si (100) Wafer were decreased in the order : 6FDA-ODA ＞ BTDA-ODA ＞ ODPA-ODA ＞ PMDA-ODA and the interfacial adhesion strength was increased in the order : 5 N/mm2 for BTDA-ODA ＞ ODPA-ODA ＞ PMDA-ODA ＞ 6FDA-ODA. It may suggest that the morphological structure, crystallinity degree of chain orientation, and packing, significantly related to the residual stress and adhesion strength in polyimide films. |
