| 초록 |
Thermal conductivity of polymer films is of great significance for the applications of electronic insulators. In addition, polyimides (PIs) have been investigated more extensively as high performance interlayer dielectrics than most other polymers due to thermal stability, excellent mechanical and dielectric properties. In this research, to attain thermally conductive polymer films, a series of PI films reinforced with hexagonal boron nitride (BN) sheet were fabricated. As a precursor of PI film, poly(amic acid) was synthesized by using 3,3’,4,4’-biphenyltetracarboxylic dianhydride and 4,4-oxydianiline. The PAA solutions containing different contents of BN sheet were spin-coated and then imidized. The molecular and morphological structures of PI/BN thin films were characterized with aids of TEM, SEM, Raman, and FT-IR. Thermal stability, thermal conductivity, and mechanical property of the thin films were investigated by using TGA, TFA, and DMA, respectively. |
