| 학회 |
한국재료학회 |
| 학술대회 |
2015년 가을 (11/25 ~ 11/27, 부산 해운대그랜드호텔) |
| 권호 |
21권 2호 |
| 발표분야 |
G. 나노/박막 재료 |
| 제목 |
Thermal and Electrical properties poly(amide–imide)/alumina nanocomposites |
| 초록 |
Poly(amide–imide) (PAI) has been widely applied insulation, such as a magnet wire for motor coil, polymer-coated copper foil for circuit board. PAI has a relatively low thermal conductivity, which may be damaged by thermal breakdown. Nanocomposites filled with high thermal conductive inorganic nanoparticles (NPs) in PAI were improved to thermal properties. Dispersion of the NPs is critical for fabricating nanocomposite because nanoparticles easily aggregate in the varnish or polymer matrix during the coating processing. Poly(amide–imide)/alumina nanocomposites(PAI/Al2O3 NCs) were prepared using α-Al2O3 and surface modified α-Al2O3 NPs as the filler and well dispersed in PAI varnish. Al2O3 was used as solvothermal synthesized α-Al2O3 NPs with uniform size distribution. To improve NPs dispersion and increase the possible interaction between NPs and PAI matrix, the surface of α-Al2O3 NPs was modified with silane coupling agent. PAI/Al2O3 NCs was coated on a copper sheet. After curing, FE-SEM images showed that NPs were dispersed into the polymer matrix. It was found that thermal conductivity as well as dielectric breakdown strength of the PAI/Al2O3 NCs was enhanced by dispersing the surface modified α-Al2O3 NPs in the polymer matrix. |
| 저자 |
Hyung Mi Lim1, Young kwan Lee2, Dae Sung Kim1, Jung1, Dae Soo1, Ho Seong Na1, Hye Youn Jo2
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| 소속 |
1KICET, 2Sungkyunkwan Univ. |
| 키워드 |
<P>Thermal property; α-Al<SUB>2</SUB>O<SUB>3</SUB>; solvothermal synthesis</P>
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| E-Mail |
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