| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.298 |
| 발표분야 | 고분자 합성 |
| 제목 | The effects of chemical structures on the curing behavior of aromatic polyisoimides |
| 초록 | Polyimides have found extensive applications as high temperature insulators and dielectrics, adhesives and matrixes for high performance composites due to their excellent electrical, thermal, and high temperature mechanical properties. The fundamental understanding of cure kinetics of these polyisoimide systems is essential to the design, optimization and control of the processing of high performance dielectrics and composites. However, investigations on thermal imidization of polyisoimides have been rather few compared to those for polyamic acids. At the meeting, we will present our findings on the thermal imidization of polyisoimide whose chemical structures are significantly different. DSC was the main characterization technique and kinetic parameters as a function of chemical structure of polyisoimides will be presented. |
| 저자 | 최석우;김영준;김덕준;김지흥;원종찬;홍영택;최길영 |
| 소속 | 성균관대 |
| 키워드 | |
