| 초록 |
FCCL (Flexible Copper Clad Laminate) is the raw material for FPCB (Flexible Printed Circuit Board). One type of FCCL is 2-layer that is composed of polyimide film and copper foil and the other is 3-layer that is composed of polyimide film, epoxy or acrylate adhesives and copper foil. In this study YD- 128 and YD-011 are selected as the base epoxy resins of the adhesives for the 3-layer FCCL, XNBR to get flexibility, and PX-200, HCA and KDP550MC65 to obtain the flame retardancy are also added. These adhesives are cured with diamino diphenyl sulfone (DDS). In this formulation polyurethane can replaced XNBR to improve thermal properties of epoxy adhesives. Properties such as peel strength, chemical resistance, soldering heat resistance, flame retardancy and thermal resistance of epoxy adhesives were studied. |
