| 초록 |
The reversible adhesion onto wet and rough surfaces or skin has been attended for the employments of clean transfer systems, bio-chips, or medical skin-patches. The conventional adhesives that rely on chemical interactions can often remain some contaminations of an engaged surface or suffer when meeting liquids. To fabricate a glue-free reversible adhesive on dry/wet surfaces and skin, we developed a microstructure-interconnected adhesive, which involves two different layers of micro-structured adhesive pad(PDMS; Poly dimethyl siloxane) and a supporting material(E-PUA; Elastic-Poly urethane acrylate) for energy-dissipation. To investigate multiscale behaviors of structural interconnection in adhesives, we changed the geometry of various pillar arrays and thickness of adhesive pads. In addition, we employed the array of octopus-inspired micro-suckers on the bottom surface of prepared adhesive pad for enhancing adhesion on wet surface. |
