| 초록 |
So many approaches such as loading of PPy into polymer matrix for increased conductivity and for high capacitance have been attempted. However, conducting polymers have some of the drawbacks to the application such as their low environmental stability, poor mechanical properties and processability. To overcome these drawbacks, we designed a new high k dielectric material using core-shell (polypyrrole-polyimide) nanoparticles. It is expected that these show a low leakage current and dissipation factor because PI shells take a role of insulating layer. These PI shells can also improve dispersibility of particles due to compatibility between PI shells and polymer matrix. Therefore, high breakdown voltage and improved processability are also expected. In this presentation, we will describe the preparation of PPy@PI core-shell nanoparticles, the formation of all-polymer PI composite film using PPy@PI particles, and on the dielectric property and the mechanical property of PI composite film. |
