| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 가을 (10/06 ~ 10/08, 제주 ICC) |
| 권호 |
39권 2호 |
| 발표분야 |
고분자구조 및 물성 |
| 제목 |
The Effects of Imidization History and Thermal Cycling on the Residual Stress Behavior of Transparent Polyimide Nanocomposites |
| 초록 |
The current trend in the interconnect development is to incorporate polymer layers together with glass, organic or ceramic layers to form a multilayered devices. One of the most important concerns is the mechanical integrity of the multilayered structures. For multilayered device, there are often reliability problems, such as displacement, cracks, and delamination at interfaces. Thermal stress causes interfacial adhesion and mechanical failures associated with interfacial residual stress due to the mismatch of physical properties between polymers and the other materials used. For this study, a computer-controlled experiment has been set up to measure the thermal stress of multilayered films using the bending wafer technique. To understand and classify these phenomena, the bending beam technique for thermal stresses kinetics according to imidization history and thermal cycling in PI nanocomposite thin films prepared from various OMMT nanoparticles were used. |
| 저자 |
남기호1, 이완수1, Patrick Han2, Sherbahadar Khan3, 한학수1
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| 소속 |
1연세대, 2예일대, 3킹 압둘아지즈 종합대 |
| 키워드 |
polyimide; nanocomposite; residual stress; imidization history; thermal cycling
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| E-Mail |
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