화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2012년 봄 (04/12 ~ 04/13, 대전컨벤션센터)
권호 37권 1호
발표분야 분자전자 부문위원회
제목 Thin Film Encapsulation for Flexible Electronics using Silicon Nitride deposited by PECVD
초록 Plastic substrates are widely used in many flexible electronic applications such as OLED and OTFTs. However, the high permeability against water vapor and oxygen induces degradation of organic electronic device deposited on them. Therefore, proper permeation barrier films are required for stable operation of organic devices. The most commonly used vapor and oxygen barrier layer are inorganic materials due to their excellent moisture and oxygen barrier even though they are extremely thin film phase. However, the barrier performance of these inorganic barrier coatings limited because of defects (pibholes and cracks) in the coating and process conditions. Therefore, in this research, by using SiNx films deposited by plasma-enhanced chemical vapor deposition (PECVD) at different process condition and by using wet-etching visualization method for pinhole detection, correlation of pinhole density and permeation property has been investigated.
저자 김래호, 윤원민, 김유진, 박찬언
소속 포항공과대
키워드 encapsulation; silicon nitride; PECVD
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