| 초록 |
Fabrication of ultrathin electronic devices followed by transfer printing enables ‘stick-and play’ system that provides high performance electronic functionalities to desired surfaces. Regarding the related transfer printing, there are several challenging issues. In relation to picking up a desirable layer and placing it onto a desired surface, perfect transfer yield with no change of position and no crack formation is of great importance. Second, when surface mismatch occurs between printable formats and receiving substrates, development of a means to allow conformal transfer printing is also important. This presentation will address these issues. |
