| 초록 |
The used of pressure sensitive adhesive (PSA) is becoming increasingly popular in many industrial fields. However, higher thermal stability of PSAs is needed especially for the recent semiconductor manufacturing processes. In this study, tris(p-isocyanatophenyl)thiophosphate was reacted with Hydroxyethyl methacrylate ,then the product was used as crosslinking agent for UV-radiation curing acrylic . A series of crosslinked acrylic PSAs were prepared with various gel fractions. The crosslinked acrylic PSA were characterized by Fourier transform infrared spectroscopy. The adhesion performance of acrylic PSA was investigated by measuring the peel strength, gel content, and dynamic mechanical analysis. The thermal properties of acrylic PSAs were evaluated by differential scanning calorimetry, thermogravimetric analysis, and thermomechanical analysis. |
