| 초록 |
Epoxy has been widely used as the thermosetting resins for semiconductor packaging or adhesive joints due to the excellent mechanical, chemical, and electrical properties. However, the performance of the material is greatly influenced by the ambient humidity, the mechanical properties of the epoxy itself are weakened, the volume is expanded, and the glass transition temperature is lowered as the moisture is absorbed into the material. In this study, to solve this problem, modified-POSS was synthesized via thiol-isocyanate reaction of aliphatic diisocyanate or aromatic diisocyanate and POSS-SH. Polyhedral oligomeric silsesquioxane (POSS) was selected to restrict chain movement of Epoxy polymer. Hexamethylene diisocyanate(HDI) and 4,4’-methylenebis(phenyl isocyanate)(MDI) were used to improve the moisture resistance of epoxy. We prepared the blend of various ratios of modified-POSS and epoxy with curing agent to prepare Epoxy with POSS-Cy. |
