| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 봄 (04/10 ~ 04/11, 대전 컨벤션센터) |
| 권호 |
39권 1호 |
| 발표분야 |
대학원생 구두발표(발표10분) |
| 제목 |
Dual curable silicone modified urethane acrylic adhesives for temporary bonding and debonding |
| 초록 |
The adhesives for temporary bonding and debonding in 3D multi-chip packaging were synthesized with using UV-curable acrylic monomers. Also this study employed semi-interpenetrated (semi-IPN) structured polymer networks with dual-curable urethane adhesives. |
| 저자 |
이승우, 김현중, 박지원, 박초희
|
| 소속 |
서울대 |
| 키워드 |
UV-curing; temporary adhesive; urethane acrylic adhesive;
|
| E-Mail |
|
