| 초록 |
Polyimide (PI) is a material that has been developed to be used in the aerospace industry. Currently it is used in semiconductors as insulators and as circuit boards in the display industry due to its desirable properties such as thermal properties and chemical resistance. In this study we have introduced a reactive norbornene monomer as an endcapping agent to the polyimide structure. PI has been synthesized through polyamic acid(PAA) with 4,4-Diamino diohenyl ether(ODA) as an diamine and 3,3’4,4’-Benzophenonetetracarboxylic Dianhydride(BTDA) as dianhydride. Norbornene monomer performs ring opening metathesis polymerization and increases the ratio of crosslinking to the structure. With the use of heat as a driving force, norbornene formed a crosslinked network polyimide to increase the thermal property and mechanical property. The ring opening polymerization of norbornene and structure of the polyimide has been speculated through FT-IR, DSC, TMA and DMA analysis |
