| 학회 |
한국고분자학회 |
| 학술대회 |
2003년 가을 (10/10 ~ 10/11, 부경대학교) |
| 권호 |
28권 2호, p.194 |
| 발표분야 |
특별 심포지엄 |
| 제목 |
A Study on the Curing Behaviors of Thick Kevlar/Epoxy Composite Material by Dielectrometry |
| 초록 |
The curing behaviors of thick Kevlar/epoxy prepreg were studied by differential scanning calorimetry and microdielectrometry method, which uses the correlation of the orientation of dipole and the ion mobility with the viscosity of resins during cure. The lowest ionic viscosities of 150 plies Kevlar/Epoxy prepregs according to the cure cycle were observed in the range of 91-105 oC, depending on the input frequencies. The maximum conductivity was also observed at about 100 oC. The curing behaviors of thick Kevlar/Epoxy prepreg was found to be similar with that of the same thin prepreg. The overshoot phenomenon was not observed in the present thick Kevlar/epoxy prepreg.
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| 저자 |
제갈영순1, 진성호2, 이원철1, 윤남균3
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| 소속 |
1경일대, 2부산대, 3국방과학(연) |
| 키워드 |
prepreg; curing; dielectrometry; composite; epoxy
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| E-Mail |
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