| 초록 |
The imide-modified thermosetting epoxy systems can be created by modifying the backbone structure of an epoxy with an imide guoup and by using a curing agent that contains imide groups. In this work, poly(imide-epoxy) composites are synthesised by curing diglycidyl ether of bisphenol-A epoxy resin (DGEBA) with imide-amines. The imide-amines are prepared by reacting 1 mol of pyromellitic dianhydride (PA) with excess (2.5 mol) of 4,4'-diaminodiphenyl methane (M), or 4,4'diaminodiphenyl sulfone (S) and designated as PAM, PAS. Meanwhile, thermal behaviors of this system are characterized in the context of cure kinetic parameters using differential scanning calorimetry (DSC) and the mechanical properties of the poly(imide-epoxy) composites are investigated by three-point bending test. |
