| 학회 |
한국고분자학회 |
| 학술대회 |
2015년 가을 (10/06 ~ 10/08, 대구컨벤션센터(EXCO)) |
| 권호 |
40권 2호 |
| 발표분야 |
대학원생 구두발표 (발표15분) |
| 제목 |
Thermal Conductivity Improvement of UV-curable Acrylic Pressure Sensitive Adhesives using Carbon-Based Fillers |
| 초록 |
Thermal property of UV cured pressure sensitive adhesives (PSAs) with addition of carbon filler were investigated. The UV cured acryl adhesive pre-polymers were prepared from 2-ethylhexyl acrylate, acrylic acid, methyl acrylate and methyl methacrylate. Carbon based fillers were added to improve thermal conductivity of PSAs. The effects of Carbon based fillers on the morphology and property of acrylic resin based UV cured PSAs were investigated. The peel strength and tackiness of UV cured PSAs were strongly dependent on amount of the filler content and the peel strength decreased with increasing Carbon based fillers. The thermal conductivity of PSAs was 0.46 W/mK by adding 20 wt% of Carbon based fillers and it is an improvement of 287% compared to that of the unfilled PSAs. It is speculated that 2-dimensional Carbon based fillers effectively formed the thermal pathway. |
| 저자 |
김성룡1, 김길년2, 박규대3
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| 소속 |
1한국교토대, 2미래나노텍, 3한국교통대 |
| 키워드 |
Thermal conductivity; adhesive; carbon
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| E-Mail |
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