화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2009년 봄 (04/15 ~ 04/17, 호텔인터불고(대구))
권호 13권 1호
발표분야 고분자
제목 Process and material characterization for embedded IC packaging
초록 Embedding is a common technology for miniaturization or performance improvement. In some cases, embedding also provides an overall product cost reduction. However, several challenges also come from the realization of this technology. These ranges from new processing step to new materials and associated reliability concerns. The main issue of reliability is relatied to bonding sheet for embedding IC. Especially, it is important to the thermomechanical properties and adhesion between Cu and bonding sheet. This paper is focused on lamination process and bonding sheet charac-terization for reliability.
저자 박진선
소속 삼성전기
키워드 embedded IC packaging
E-Mail jinseon.park@samsung.com