학회 | 한국재료학회 |
학술대회 | 2015년 봄 (05/14 ~ 05/15, 구미코) |
권호 | 21권 1호 |
발표분야 | A. 전자/반도체 재료 |
제목 | Effect of Carbon Powder Volume on the Electronic Properties of Polystyrene Matrix Composites with Carbon Powder |
초록 | Carbon powder-filled polystyrene matrix composites, applied to electronic materials such as switching elements, conductive paint, are fabricated by mixing roll technique. The mixing condition of carbon powder and polystyrene matrix is carefully chosen to control the volume of carbon powders which strongly affects the electronic performance of the composites. It is well known that the change in resistivity shows two break-points for filling carbon powder into insulating polystyrene matrix. The first break-point of resistivity shows a large change in resistivity from insulating to non-insulating properties by filling carbon powder. The large change of the resistivity at a critical conducting-phase concentration, the universal behavior of the resistivity and the concentration dependence of the geometrical noise all suggest the applicability of percolation theory to the composites. The second break-point appears after the first large change and the decrease in resistivity declined with continued filling carbon powder. However, it seems that there is confusion about the change of percolation threshold for carbon powder-filled polystyrene matrix composites. It should be noted that there are many ambiguous statements in previous researches about the change of percolation threshold of the composites. In this research, investigations of the changes in resistivity and relative permittivity for filling carbon powder, the critical exponent of conductivity, and the electric field dependence of current are presented. It is confirmed that the second transition of resistivity is the percolation threshold for the carbon powder-filled polystyrene matrix composites. This work has been supported by SYOWA Co. Ltd., Tokyo (Japan) |
저자 | 신순기 |
소속 | 강원대 |
키워드 | polystyrene; percolation threshold; carbon powder; composites; tunneling conduction <BR> |