| 초록 |
The epoxy–imidazole resin system is used to form the flexible printed circuit board (FPCB) joining. The pot-life of the system is very significant to FPCB production. 2-phenylimidazole (2Pz) encapsulated particles were produced for the latent curing agent system to use in the reaction of epoxy resin. Polycaprolactone (PCL) was used as a wall material, and the electrospray method was used to fabricate the microcapsule. Stable process with spherical morphology of microcapsule was found with 3% of PCL polymer, voltage of 10kV, polymer federate of 0.5 mL/h, needle size of 0.26 cm, tip-to-collection (TTC) distance of 25 cm, and 2Pz concentration of 0.25 and 0.5%. The encapsulation rate was approximately 7.5%. The permeability test showed microcapsule released almost all of 2Pz content after 150 minutes. |
