| 초록 |
For smaller chips, all parts of semiconductor become smaller, and, accordingly, interconnection lines are thinner. But aluminum, existing interconnection metal, confronts of the limits, electromigration(EM) and resistivity problems like. Therefore, alternating metals are researching, and copper is one of those. But copper deposits on silicon or silicon dioxide(SiO2), it diffuses into substrates. Because of that, barrier layer is essential for copper deposition on specific substrate, like silicon. Barrier layer generally adopted metal series or its nitrides, like Ti, Ta, Ru or TiN, TaN, etc. Among them, after choosing a tantalum and titanium, compared surface characteristics of sputtered Ta, Ti on Si(100) against those of bare Si(100) and predicted advantages in deposition process of copper. |
