| 초록 |
Improving the thermal behavior at elevated temperatures such as the CTE (coefficient of thermal expansion) of a polymer is important in the microelectronic and aerospace industry. In this study, low CTE polyimide (PI) has been synthesized through ring opening polymerization of the endcapping agent. End capped PI was synthesized via polyamic acid(PAA) with 4,4’-Diaminodiohenyl ether(ODA), 3,3’4,4’-Benzophenonetetracarboxylic Dianhydride (BTDA) and an endcapping agent. With the use of heat, ring opening crosslinking formed network polymers to improve the modulus and reduce the CTE. We were able to confirm that the improvement of thermal behaviors and modulus is due to the dense packaging of the molecules through ring opening crosslinking. |
