| 초록 |
Polymer-based nanocomposites filled with inorganic fillers have been intensively studied due to their excellent mechanical, electrical, thermal and dielectric properties. Especially, the polymer/silver nanocomposites have been extensively studied for isotropical conductive adhesives (ICAs) application. In this work, we have illustrated a novel method, both experimentally and theoretically, for improving the electrical conductivity and thermomechanical properties of epoxy/silver nanocomposites by adding silica particles. Upon addition of silica particles, both the electrical percolation threshold concentration of the silver nanoparticles and the electrical resistivity of the composite decreased significantly. Adding silica particles also enhanced the thermomechanical properties, such as coefficient of thermal expansion (CTE). In the second part, we have demonstrated the facile preparation of polymer nanocomposites with high dielectric constant and low loss factor using carbon materials as fillers for capacitive sensor. |
