| 초록 |
The effect of thiourea on the microstructure and mechanical properties of the electrodeposited Ni-P deposit was studied to develop a thin substrate for a high performance magnetic thin film. As the thiourea content in the bath increases, the P content of the Ni-P layer tends to be decreased, whereas, the crystallinity to be increased with the preferential growth of the (111) plane. Relatively smooth and clean surface were observed on the surface of the Ni-P layers electroformed in the bath without thiourea and with 0.01 g/L thiourea. Further adding the thiourea like 0.03, 0.05, 0.07 and 0.1 [g/L] makes the cauliflower-like nodules on the surface of the Ni-P deposits. Resultant surface roughness of the Ni-P deposits increases with thiourea from 6 to 54 [nm]. The elastic modulus, nano-hardness and stiffness increases with thiourea from 77 to 156 [GPa], 6.6 to 8.9 [GPa] and 109.6 to 186.6 [μN/nm], respectively. |
