| 학회 | 한국재료학회 |
| 학술대회 | 2016년 가을 (11/16 ~ 11/18, 경주 현대호텔) |
| 권호 | 22권 2호 |
| 발표분야 | G. 나노/박막 재료 분과 |
| 제목 | Electromagnetic Interference Shielding effectiveness of Electroplated Copper-Graphene Multilayered Sandwich Thin Film |
| 초록 | Recently, trends in electronic devices are focused on high performance and miniaturization. For this reason, the issues of electromagnetic interference(EMI) shielding and heat dissipation materials has become more important. Because of the operating frequency range of electronic devices is increased to 1~10GHz, many negative effects occur, like heating issue and signal interference, device malfunction. In this study, we examine characterization of EMI shielding and heat dissipation properties of Cu-graphene multilayered sandwich thin film. According to recently study, graphene has better EMI shielding property more than gold film. Also Cu is well known high frequency electromagnetic field shielding material. So we combine two materials to enhance EMI shielding and heat dissipation properties. To assess additional properties of Cu-graphene multilayered sandwich film, the film is investigated by XRD, SEM and TEM. |
| 저자 | 김석훈, 조영래, 이정우, 김선우, 송영일, 서수정 |
| 소속 | 성균관대 |
| 키워드 | graphene; electroplating; copper; EMI shielding |
