| 학회 | 한국공업화학회 |
| 학술대회 | 2015년 봄 (04/29 ~ 05/01, BEXCO (부산)) |
| 권호 | 19권 1호 |
| 발표분야 | 접착제도료잉크_포스터 |
| 제목 | Study of curing characteristics of the IT epoxy adhesive in the content of the additive |
| 초록 | LED(light emitting diode) has been used in various fields because it has a lot of advantages with their high efficiency, long-lived and high-speed response. Recently, it is still ongoing for the development of an epoxy adhesive to lower the BLU(back light unit) prices. We use IT epoxy adhesive to attach LED lenses on board and their response characteristic is changed by hardener kind, multiple construct because of their particular curing characteristic. In this study, we investigate the effect of additive content on the adhesion of IT epoxy adhesives. And in this investigation, the adhesion strength, curing peak and gel time were found to be enhanced by additive content in epoxy adhesive. |
| 저자 | 류주민, 신교직, 최경호, 이상국 |
| 소속 | 한국생산기술(연) |
| 키워드 | LED; epoxy adhesive; adhesion strength; IT epoxy |
