| 초록 |
Strong adhesion strength is required to hold thin wafer tightly during dicing for semi-conductor manufacturing process. The acrylic copolymers, which were used as base polymer for adhesives, were synthesized by solution polymerization of n-butyl acrylate, ethyl acrylate, and acrylic acid with AIBN as an initiator. The acrylic copolymers of several different molecular weights were prepared with various contents of initiator. The acrylic copolymer adhesives were investigated in terms of viscosity, molecular weight, and initial tackiness. The acrylic copolymer with lower molecular weight showed better adhesion performance. |
