| 초록 |
Epoxy molding compound (EMC), which is prepared from epoxy resins, silica fillers, and silane coupling agents, is designed to provide good thermal and mechanical properties. Silica filler has been used to improve the thermal properties and thermal expansion coefficient of EMC. Silane coupling agent has been used to establish strong adhesion between the epoxy resin and the silica filler. In this work, silane coupling agent treated silica-filled epoxy resins were prepared for the purpose of EMC. The cure behaviors of EMC according to the silica content have been investigated using fourier transform infrared (FT-IR) and differential scanning calorimetry (DSC). The effect of the silica content on thermal properties of EMC is also investigated using thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA). Coefficient of thermal expansion of EMC is investigated using thermal mechanical analysis (TMA). |
