| 학회 |
한국화학공학회 |
| 학술대회 |
2003년 가을 (10/24 ~ 10/25, 한양대학교) |
| 권호 |
9권 2호, p.2706 |
| 발표분야 |
재료 |
| 제목 |
Preparation of nano-copper-coated steel plates and characterization of adhesion to rubber compounds by analysis of AES depth profile |
| 초록 |
Three nano-copper-coated steel plates with different thicknesses of copper film 29 to 56㎚ were prepared by RF sputtering and their adhesion properties to rubber compounds were examined. The high adhesion of nano-copper-coated steel plates to the rubber compound was obtained at optimum and over-cure conditions. Under optimum cure, the nano-copper-coated steel plate with thick copper coating (56 nm) showed better adhesion to rubber compound than that having thin copper coating. But the nano-copper-coated steel plate with thin copper coating (29 nm) showed better adhesion to rubber compound than that having thick copper coating under over cure. These phenomena may be explained as the reaction rates of copper sulfide formation and surface migration of iron over copper at adhesion interphase under the cure of rubber compound to nano-copper-coated steel plate. Under optimum cure, surface migration of iron over copper at adhesion interphase is dominant whereas copper sulfide formation at adhesion interphase formation is dominant under over cure. |
| 저자 |
전경수1, 서 곤2, 정승원1, 최석주3
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| 소속 |
1담양대 환경정보과, 2전남대 응용화학부, 3금호타이어(주) 컴파운드개발팀 |
| 키워드 |
Adhesion; Rubber compound; Nano-copper-coated steel plate; Adhesion interphase; Copper-sulfide formation; Surface enrichment of Fe over Cu; Auger electron spectroscopy |
| E-Mail |
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| 원문파일 |
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