| 초록 |
Great amount of CFRP chip occurred after the composite manufacturing process. CFRP chips were added to phenolic resin matrix for the reinforcement. The interfacial properties were dependent upon the chip treatment conditions. To explore the effects of changing interfacial conditions, acid and thermal treatments were applied. The ER measurement was used to evaluate the dispersion conditions of phenolic nanocomposites. FE-SEM was used to observed the interface changes between carbon fiber and phenolic resin, whereas mechanical thermal damage was evaluated for different treatment (200-600 ℃ ranges). Interfacial property was also evaluated by contact angle test. The interfacial property of the CFRP chip by thermal treatment was better than neat CFRP chip, because of improved carbon fiber between the phenolic resin which resulted in improved ER properties and adhesion. Acknowledgement: Kwon, Dong-Jun is grateful to the second stage of BK21 program for supporting a fellowship. |
